At least one die produced, at least in part, from wafer, and including at least one replicated integrated circuit
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United States of America Patent
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Jan 13, 2015
Issued Date -
N/A
app pub date -
Mar 16, 2012
filing date -
Mar 16, 2012
priority date (Note) -
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Abstract
An embodiment may include at least one die produced, at least in part, from a wafer, and may include at least one integrated circuit and/or at least one other integrated circuit. These integrated circuits may be mutual replications of each other and may include respective core and additional blocks. Each respective core block may have an associated respective capability. As formed in the wafer, the respective additional blocks may be coupled together so as to permit the associated respective capabilities of the respective core blocks to be functionally combined to provide an increased capability relative to each of the associated respective capabilities considered separately, and also so as to permit the integrated circuits to be externally interfaced as a unified device. The wafer may be separable into respective dice including respective of the integrated circuits such that the integrated circuits include respective external interfaces. Many modifications are possible.
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