Integrated circuit package system with molded strip protrusion

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8937372
SERIAL NO

11689317

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Abstract

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An integrated circuit package system includes an in-line strip, attaching an integrated circuit die over the in-line strip, and applying a molding material with a molded segment having a molded strip protrusion formed therefrom over the in-line strip.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Myung, Junwoo Kyungsang-do, KR 21 250
Yee, Jae Hak Singapore, SG 36 1001

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