Integrated circuit packaging system with trenched leadframe and method of manufacture thereof

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United States of America Patent

PATENT NO 8937379
SERIAL NO

13934797

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Importance

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Abstract

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A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a trench; mounting an integrated circuit device on the leadframe; forming a top encapsulation on the leadframe and the trench; forming a lead having a lead protrusion and a peripheral groove, the lead protrusion and the peripheral groove formed from etching the trench at a leadframe bottom side; and forming a bottom encapsulation surrounding a lead bottom side of the lead.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chua, Linda Pei Ee Singapore, SG 133 2721
Do, Byung Tai Singapore, SG 246 5097
Trasporto, Arnel Senosa Singapore, SG 61 486
Yusof, Asri Singapore, SG 5 25

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