Micro-scale system to provide thermal isolation and electrical communication between substrates
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United States of America Patent
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Jan 20, 2015
Issued Date -
N/A
app pub date -
May 9, 2013
filing date -
May 11, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus includes a chip-scale atomic clock (CSAC) alkali vapor cell seated on a silicon substrate that is suspended in a package by a metalized Parylene strap having Parylene anchors embedded in a silicon frame, the Parylene strap comprising an extended rigidizing structure, and a plurality of electrical pins extending into an interior of the package, the plurality of electrical pins in electrical communication with the CSAC cell through the metalized Parylene strap, where the CSAC cell is mechanically connected to the package and thermally insulated from the package.
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International Classification(s)
- B05D:PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
- B81B:MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-ME....
- G04F:TIME-INTERVAL MEASURING
- H01S:DEVICES USING STIMULATED EMISSION
- C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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