Membrane assembly and carrier head having the membrane assembly
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United States of America Patent
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Jan 27, 2015
Issued Date -
N/A
app pub date -
May 29, 2012
filing date -
May 31, 2011
priority date (Note) -
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Abstract
Provided is a membrane assembly of a carrier head in a chemical-mechanical polishing apparatus. The membrane assembly includes a main membrane and a circular ring. The main membrane has a wafer contacting surface in contact with a wafer while a chemical-mechanical polishing process is being performed. The circular ring is disposed at an edge portion of the main membrane and receives an air pressure to downwardly apply the air pressure to the main membrane at the edge portion.
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