Electronic apparatus, method of manufacturing substrate, and method of manufacturing electronic apparatus

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United States of America Patent

PATENT NO 8941017
SERIAL NO

12984929

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electronic apparatus includes: a substrate which has a step portion in an edge portion; an electronic component which is bonded to a surface of the substrate inward of the step portion of the substrate; and a cap member which is bonded to the step portion so as to seal the electronic component, wherein a wall surface of the step portion is formed to be inclined from the step portion toward an electronic component bonding region or to be perpendicular to the step portion.

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Patent Owner(s)

  • SEIKO EPSON CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagano, Yoji Chigasaki, JP 16 256

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