Semiconductor package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8941221
APP PUB NO 20130082371A1
SERIAL NO

13626899

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Abstract

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A semiconductor package includes a die pad, at least one semiconductor die mounted on the die pad, a plurality of leads disposed along peripheral edges of the die pad, at least one connecting bar for supporting the die pad, a first power bar disposed on one side of the connecting bar, a second power bar disposed on the other side of the connecting bar, and a connection member traversing the connecting bar and electrically connecting the first power bar with the second power bar.

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Patent Owner(s)

Patent OwnerAddress
MEDIATEK INCNO 1 DUSING RD 1ST SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Nan-Jang Hsinchu, TW 38 406

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