Electroless copper deposition

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United States of America Patent

PATENT NO 8946087
APP PUB NO 20130203249A1
SERIAL NO

13364924

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Abstract

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A method for providing metal filled features in a layer is provided. A metal seed layer is deposited on tops and bottoms of the features. Metal seed layer on tops of the features and overhangs is removed without removing metal seed layer on bottoms of features. An electroless deposition of metal is provided to fill the features, wherein the electroless deposition first deposits on the metal seed layer on bottoms of the features.

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Patent Owner(s)

  • LAM RESEARCH CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nalla, Praveen Reddy Fremont, US 2 13

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