Imprint method, imprint apparatus, and method of manufacturing semiconductor device
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United States of America Patent
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Feb 3, 2015
Grant Date -
Mar 28, 2013
app pub date -
Mar 15, 2012
filing date -
Sep 22, 2011
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Abstract
In an imprint method of an embodiment, in the imprinting of an imprint shot including an outermost peripheral region of a substrate where resist is not desired to be entered at the time of imprinting, light curing the resist is applied to a light irradiation region with a predetermined width including a boundary between the outermost peripheral region and a pattern formation region more inside than the outermost peripheral region, whereby the resist which is to enter inside the outermost peripheral region is cured. Then, light curing the resist filled in a template pattern is applied onto a template.
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