Redistribution structures for microfeature workpieces
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United States of America Patent
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Feb 3, 2015
Issued Date -
N/A
app pub date -
Aug 28, 2007
filing date -
Aug 28, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
Microfeature dies with redistribution structures that reduce or eliminate line interference are disclosed. The microfeature dies can include a substrate having a bond site and integrated circuitry electrically connected to the bond site. The microfeature dies can also include and a redistribution structure coupled to the substrate. The redistribution structure can include an external contact site configured to receive an electric coupler, a conductive line that is electrically connected to the external contact site and the bond site, and a conductive shield that at least partially surrounds the conductive line.
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