Capacitive coupling of bond pads
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United States of America Patent
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Feb 3, 2015
Issued Date -
N/A
app pub date -
Dec 1, 2011
filing date -
Dec 1, 2011
priority date (Note) -
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Abstract
In one embodiment, a system includes a touch sensor comprising a first set of electrodes and a first set of bond pads electrically coupled to the first set of electrodes. The system also includes a second set of bond pads capacitively coupled to the first set of bond pads. Each bond pad of the second set of bond pads is coincident with a bond pad of the first set of bond pads. The system also includes a circuit electrically coupled to the second set of bond pads such that signals may be communicated from the first set of bond pads to the circuit.
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