Semiconductor device and production method thereof
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United States of America Patent
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Feb 10, 2015
Grant Date -
Apr 3, 2014
app pub date -
Sep 11, 2013
filing date -
Oct 1, 2012
priority date (Note) -
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Abstract
A semiconductor device according to an embodiment includes: a first unit device configured to include a semiconductor chip, a backside electrode that is in contact with a backside of the semiconductor chip, and a bonding wire in which one end is connected to the backside electrode; a second unit device configured to have a function different from that of the first unit device; a resin layer configured to fix the first and second unit devices to each other; and a first wiring that is formed on the resin layer on a surface side of the semiconductor chip and connected to the other end of the bonding wire.
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