Implementing graphene interconnect for high conductivity applications

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United States of America Patent

PATENT NO 8952258
APP PUB NO 20140083741A1
SERIAL NO

13624158

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Abstract

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A method, and structures for implementing enhanced interconnects for high conductivity applications. An interconnect structure includes an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane. A winded graphene ribbon is carried around the electrically conductive interconnect member, providing increased electrical current carrying capability and increased thermal conductivity.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Plucinski, Mark D Rochester, US 41 169
Sinha, Arvind K Rochester, US 91 498
Thompson, Thomas S Lake City, US 10 361

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