Low cost anti-fuse structure
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United States of America Patent
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Feb 10, 2015
Issued Date -
N/A
app pub date -
Oct 23, 2013
filing date -
Jul 18, 2012
priority date (Note) -
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Abstract
An anti-fuse structure is provided in which an anti-fuse material liner is embedded within one of the openings provided within an interconnect dielectric material. The anti-fuse material liner is located between a first conductive metal and a second conductive metal which are also present within the opening. A diffusion barrier liner separates the first conductive metal from any portion of the interconnect dielectric material. The anti-fuse structure is laterally adjacent an interconnect structure that is formed within the same interconnect dielectric material as the anti-fuse structure.
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