Organic module EMI shielding structures and methods
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United States of America Patent
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Feb 10, 2015
Grant Date -
Jul 31, 2014
app pub date -
Jan 29, 2013
filing date -
Jan 29, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An electromagnetic interference (EMI) shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.
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