Wafer level package and fabrication method
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United States of America Patent
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Feb 10, 2015
Issued Date -
N/A
app pub date -
Apr 29, 2014
filing date -
Nov 8, 2002
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
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