Method for manufacturing semiconductor light-emitting element

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United States of America Patent

PATENT NO 8956887
APP PUB NO 20140220714A1
SERIAL NO

14129970

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Abstract

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The invention is directed to the provision of a method for manufacturing a semiconductor light-emitting element that eliminates the need for preparing a plurality of different fluorescent sheets. The method for manufacturing the semiconductor light-emitting element containing an LED die includes the steps of arranging the LED die on a fluorescent sheet containing a fluorescent substance and adjusting the amount by which the LED die is depressed into the fluorescent sheet so that the semiconductor light-emitting element has a desired color emission.

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Patent Owner(s)

  • CITIZEN ELECTRONICS CO., LTD.;CITIZEN HOLDINGS CO., LTD.;CITIZEN ELECTRINOCS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sorimachi, Kazuaki Saitama, JP 7 239

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