Methods of eliminating pattern collapse on photoresist patterns
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United States of America Patent
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Feb 17, 2015
Grant Date -
Feb 6, 2014
app pub date -
Oct 2, 2013
filing date -
Apr 8, 2004
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Abstract
A stabilizing solution for treating photoresist patterns and methods of preventing profile abnormalities, toppling and resist footing are disclosed. The stabilizing solution comprises a non-volatile component, such as non-volatile particles or polymers, which is applied after the photoresist material has been developed. By treating the photoresist with the solution containing a non-volatile component after developing but before drying, the non-volatile component fills the space between adjacent resist patterns and remains on the substrate during drying. The non-volatile component provides structural and mechanical support for the resist to prevent deformation or collapse by liquid surface tension forces.
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