Integrated circuit packaging system with thermal emission and method of manufacture thereof
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United States of America Patent
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Feb 17, 2015
Grant Date -
Dec 27, 2012
app pub date -
Jun 23, 2011
filing date -
Jun 23, 2011
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a lead array having an innermost space with an innermost lead having an inner lead profile different around an inner non-horizontal side of the innermost lead; forming a middle lead having a middle lead profile the same around a lead side of the middle lead; placing an integrated circuit in the innermost space adjacent to the innermost lead; and forming a package encapsulation over the integrated circuit, the innermost lead, and the middle lead.
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