Integrated circuit package system with array of external interconnects
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United States of America Patent
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Feb 17, 2015
Grant Date -
May 7, 2009
app pub date -
Nov 7, 2007
filing date -
Nov 7, 2007
priority date (Note) -
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Abstract
An integrated circuit package system includes: forming an array of external interconnects with an intersecting region between the external interconnects; removing the intersecting region for forming an isolation hole between the external interconnects; mounting an integrated circuit die over the external interconnects; connecting an internal interconnect between the integrated circuit die and the external interconnects; and forming a package encapsulation over the integrated circuit die with the external interconnects partially exposed.
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