Motherboard assembly for interconnecting and distributing signals and power

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8958214
APP PUB NO 20130055192A1
SERIAL NO

13611609

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Importance

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Abstract

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Mechanisms for interconnecting and distributing signals and power between PCBs are provided. A first PCB having land grid arrays (LGAs) and a first wiring layer designed for interconnect components on the first PCB, and a second wiring layer for connecting the components to a second PCB, are provided. The second PCB has opposed parallel first and second surfaces, the first surface having a LGA. A wiring layer designed to interconnect components on the second PCB, and a layer for interconnecting the components on the second PCB with the components on the first PCB, are provided. A first interposer couples to a LGA of a first surface of the first PCB and connects a component to the first PCB. A second interposer is sandwiched between and couples to a LGA of a second surface of the first PCB and to the LGA of the first surface of the second PCB.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Colbert, John L Byron, US 24 298
Sinha, Arvind K Rochester, US 91 498
Weekly, Roger D Austin, US 54 380

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