Metallurgical clamshell methods for micro land grid array fabrication
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United States of America Patent
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Feb 24, 2015
Grant Date -
May 12, 2011
app pub date -
Nov 6, 2009
filing date -
Nov 6, 2009
priority date (Note) -
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Abstract
A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.
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