Wireless IC device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8960557
SERIAL NO

12903242

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.

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Patent Owner(s)

  • MURATA MANUFACTURING CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikemoto, Nobuo Moriyama, JP 121 1751
Kato, Noboru Moriyama, JP 456 6240

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