Stacked packaged integrated circuit devices, and methods of making same
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United States of America Patent
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Feb 24, 2015
Grant Date -
Oct 3, 2013
app pub date -
May 21, 2013
filing date -
May 16, 2007
priority date (Note) -
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Abstract
A device is disclosed which includes a first packaged integrated circuit device, a second packaged integrated circuit device positioned above the first packaged integrated circuit device and a plurality of planar conductive members conductively coupling the first and second packaged integrated circuit devices to one another. A method is also disclosed which includes conductively coupling a plurality of extensions on a leadframe to each of a pair of stacked packaged integrated circuit devices and cutting the leadframe to singulate the extensions from one another.
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