Integrated circuit packaging system with thermal structures and method of manufacture thereof
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United States of America Patent
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Feb 24, 2015
Grant Date -
Apr 11, 2013
app pub date -
Jun 20, 2012
filing date -
Oct 7, 2011
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a thermal attach cluster includes: forming a heat collector having a heat dissipation surface, forming a cluster bridge, having a thermal surface, connected to the heat collector, forming a cluster pad, having an attachment surface, connected to the end of the cluster bridge opposite the heat collector; connecting an integrated circuit to the thermal attach cluster; and forming an encapsulation over the thermal attach cluster with the heat dissipation surface, the thermal surface, and the attachment surface exposed from and coplanar with the encapsulation.
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