Semiconductor device including cladded base plate

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United States of America Patent

PATENT NO 8963321
APP PUB NO 20130134572A1
SERIAL NO

13749006

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Abstract

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A semiconductor device includes a semiconductor chip joined with a substrate and a base plate joined with the substrate. The base plate includes a first metal layer clad to a second metal layer. The second metal layer is deformed to provide a pin-fin or fin cooling structure. The second metal layer has a sub-layer that has no pins and no pin-fins. The first metal layer has a first thickness and the sub-layer has a second thickness. The ratio between the first thickness and the second thickness is at least 4:1.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGNEUBIBERG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hohlfeld, Olaf Warstein, DE 43 599
Lenniger, Andreas Anroechte, DE 8 347
Uhlemann, Andre Dortmung, DE 14 421

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