Thin wafer support assembly

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United States of America Patent

PATENT NO 8963337
SERIAL NO

12893355

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Abstract

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A semiconductor wafer assembly formed by bonding a support wafer to a thin wafer using a double-sided bonding release tape. The support wafer provides support for the thin target wafer such that existing handling tools can accommodate transporting and processing the assembly without compromising the profile of the thin target wafer.

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Patent Owner(s)

Patent OwnerAddress
VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES INC35 DORY ROAD GLOUCESTER MA 01930

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Riaf, Arthur Paul Gloucester, US 2 8

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