Process for placing, securing and interconnecting electronic components

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8963341
APP PUB NO 20100206462A1
SERIAL NO

12734055

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Abstract

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A method for fabricating an electronic assembly which enables the assembly and interconnection of surface mount components and/or other electrical, electronic, electro-optical, electro-mechanical and user interface devices with external I/O contacts on a planar surface without the use of solder or otherwise exposing the components to temperatures substantially above ambient.

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Patent Owner(s)

  • PROMEX INDUSTRIES, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Binkley, Edward Los Altos, US 2 0
Cattaneo, Robert San Jose, US 2 0
Laurie, George Fremont, US 4 27
Nghi, Hiep San Jose, US 2 0
Otte, Richard Los Altos Hills, US 2 0

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