Solid-state imaging device, method of manufacturing the same, and electronic apparatus having an on-chip micro lens with rectangular shaped convex portions

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8969776
APP PUB NO 20130327927A1
SERIAL NO

13964962

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A solid-state imaging device includes a light sensing portion which is formed on a substrate and generates a signal electric charge according to incident light; a rectangular or gradient-index on-chip micro lens formed on a light incident side above the light sensing portion; and a planarized lens layer which covers the on-chip micro lens and is formed in such a manner that a light incident surface is planarized.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • SONY SEMICONDUCTOR SOLUTIONS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Otsuka, Yoichi Kanagawa, JP 36 288
Toda, Atsushi Kanagawa, JP 211 2629
Wano, Hiromi Kanagawa, JP 10 79
Yamamoto, Atsushi Kumamoto, JP 458 5795

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 3, 2026
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00