Embedded heat spreader for package with multiple microelectronic elements and face-down connection
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United States of America Patent
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Mar 3, 2015
Grant Date -
Jul 4, 2013
app pub date -
Dec 29, 2011
filing date -
Dec 29, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectronic package includes a substrate, first and second microelectronic elements, and a heat spreader. The substrate has terminals thereon configured for electrical connection with a component external to the package. The first microelectronic element is adjacent the substrate and the second microelectronic element is at least partially overlying the first microelectronic element. The heat spreader is sheet-like, separates the first and second microelectronic elements, and includes an aperture. Connections extend through the aperture and electrically couple the second microelectronic element with the substrate.
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