Solution to deal with die warpage during 3D die-to-die stacking
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United States of America Patent
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Mar 3, 2015
Grant Date -
Jan 1, 2015
app pub date -
Jun 28, 2013
filing date -
Jun 28, 2013
priority date (Note) -
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Abstract
A method including forming a contact pad array on an integrated circuit substrate, the contact pad array including a first plurality of contact pads and a second plurality of contact pads, wherein an accessible area of each of the first plurality of contact pads is different than an accessible area of each of the second plurality of contact pads; and depositing solder on the accessible area of the contact pads. An apparatus including an integrated circuit substrate including a body having a nonplanar shape and a surface including a first plurality of contact pads and a second plurality of contact pads, wherein an accessible area of each of the first plurality of contact pads is different than an accessible area of each of the second plurality of contact pads.
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