Standoff RFID elements
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United States of America Patent
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Mar 10, 2015
Grant Date -
N/A
app pub date -
Apr 8, 2013
filing date -
Apr 6, 2012
priority date (Note) -
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Importance
Abstract
A standoff RFID element includes a generally planar, hollow, standoff member with a pair of major outer walls connected by a plurality of structural components like ribs and at least a first piece of flexible, planar, non-conductive polymer substrate having one major side bonded with a major side of the standoff member. An RFID inlay is encapsulated between the hollow member and the piece of polymer substrate. The hollow member is formed from a non-conductive, non-porous, polymer material. The flexible substrate is non-conductive and substantially porous.
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