Methods of planarization and electro-chemical mechanical polishing processes
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United States of America Patent
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Mar 10, 2015
Grant Date -
Sep 24, 2009
app pub date -
Mar 24, 2008
filing date -
Mar 24, 2008
priority date (Note) -
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Abstract
A method of removing a material from a surface includes providing a substrate comprising a material having a surface, contacting the surface with a polishing medium, applying a voltage to the substrate to remove material from the surface, and changing the voltage during the removing material from the surface. An electro-chemical mechanical polishing method includes providing a substrate having a surface, applying a platen to the surface, applying a first voltage to the substrate, rotating the platen and surface relative to each other at a first rotational speed, increasing to a second voltage, and decreasing to a second rotational speed.
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