Pattern forming method

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United States of America Patent

PATENT NO 8974680
APP PUB NO 20120228262A1
SERIAL NO

13426166

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Abstract

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A pattern forming method includes forming a coating film containing a hydrophilic first homopolymer having a first bonding group and a hydrophobic second homopolymer having a second bonding group capable of bonding with the first bonding group, forming a bond between the first and second bonding group to produce a block copolymer of the first and second homopolymers, and heating the coating film to microphase-separating the copolymer into a hydrophilic domain and a hydrophobic domain. The hydrophilic and hydrophobic domains are arranged alternately. The bond is broken, then selectively dissolving-removing either domain by a solvent to provide a polymer pattern of a remainder domain.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOSHIBA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kihara, Naoko Matsudo, JP 55 616
Tanaka, Hiroki Fuchu, JP 353 2283
Yamamoto, Ryosuke Kawasaki, JP 78 206

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