Composition for polishing and composition for rinsing

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United States of America Patent

PATENT NO 8974691
APP PUB NO 20130183826A1
SERIAL NO

13824149

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Abstract

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A polishing composition for a silicon wafer and a rinsing composition for a silicon wafer according to the present invention contain a nonionic surfactant of a polyoxyethylene adduct. The HLB value of the polyoxyethylene adduct is 8 to 15. The weight-average molecular weight of the polyoxyethylene adduct is 1400 or less. The average number of moles of oxyethylene added in the polyoxyethylene adduct is 13 or less. The content of the polyoxyethylene adduct in each of the polishing composition and the rinsing composition is 0.00001 to 0.1% by mass.

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Patent Owner(s)

  • FUJIMI INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takahashi, Shuhei Kiyosu, JP 60 303
Tsuchiya, Kohsuke Kiyosu, JP 35 84

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