Sinterable silver flake adhesive for use in electronics

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8974705
APP PUB NO 20130187102A1
SERIAL NO

13799002

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAA40589 DÜSSELDORF

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cao, Xinpei Cambridge, GB 5 11
Grossmann, Matthias Aschaffenburg, DE 16 20
Kuder, Harry Richard Fullerton, US 14 52
Sanchez, Juliet Grace Carson, US 5 13

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 10, 2026
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00