Metal-ceramic substrate and method for manufacturing such a substrate

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United States of America Patent

PATENT NO 8974914
APP PUB NO 20120107642A1
SERIAL NO

13279701

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Abstract

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A metal-ceramic substrate for electrical circuits or modules includes at least one first outer metal layer forming one first surface side of the metal-ceramic substrate and at least one second outer metal layer forming one second surface side of the metal-ceramic substrate. The outer metal layers are bonded respectively by two-dimensional bonding with the surface sides of a plate-like substrate body.

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Patent Owner(s)

Patent OwnerAddress
ROGERS GERMANY GMBH92676 ESCHENBACH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Meyer, Andreas Wenzenbach, DE 162 997
Schulz-Harder, Jürgen Lauf, DE 16 77

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