Interconnect substrate and electronic device
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United States of America Patent
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Mar 10, 2015
Grant Date -
Jun 6, 2013
app pub date -
May 25, 2011
filing date -
Aug 30, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is an interconnect substrate that includes a laminated body including an electric conductor and an insulator, over which an electronic element (141) is disposed, wherein the laminated body includes a first layer (130) having at least one first conductor (131) separated in an island shape, a first connecting member (142) which is buried in the laminated body in order to electrically connect the electronic element (141) and the first conductor (131), a second layer (110) having a third conductor (111) which is provided opposite to at least a partial region of the first conductor (131), a second conductor (122) which is provided opposite to at least one of the first conductor (131) and the third conductor (111) with a layer of an insulator interposed therebetween, wherein when the laminated body is seen in a plan view, the second conductor (122) is located at a region less than a quarter of a wavelength occurring at a frequency of noise propagated from the electronic element (141) to the first conductor (131), from an end of the first conductor (131).
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