Hot-wire sensor of submillimeter size and associated method of production
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United States of America Patent
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Mar 17, 2015
Grant Date -
May 23, 2013
app pub date -
Apr 11, 2011
filing date -
Apr 12, 2010
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Abstract
The invention relates to a submillimeter-sized hot-wire sensor (1) comprising a substrate (10), two support rods (11, 12), a metal wire (13) extending between the two ends of the support rods (11, 12), and electrical contacts (14, 15) disposed on the support rods, said contacts each being linked to one of the ends of the wire (13). The metal wire comprises at least two layers of metal materials, one of said layers being made of a material exhibiting a residual stress under tension and the other layer being made of a material exhibiting a residual stress under compression. The thicknesses of these metal layers are adapted so as to compensate the residual stresses between the various layers.
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