Electromechanical transducer and method of manufacturing the same
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United States of America Patent
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Mar 17, 2015
Grant Date -
May 1, 2014
app pub date -
Jan 3, 2014
filing date -
Oct 15, 2010
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An electromechanical transducer includes multiple elements each including at least one cellular structure, the cellular structure including: a semiconductor substrate, a semiconductor diaphragm, and a supporting portion for supporting the diaphragm so that a gap is formed between one surface of the substrate and the diaphragm. The elements are separated from one another at separating locations of a semiconductor film including the diaphragm. Each of the elements includes in a through hole passing through a first insulating layer including the supporting portion and the semiconductor substrate: a conductor which is connected to the semiconductor film including the diaphragm; and a second insulating layer for insulating the conductor from the semiconductor substrate.
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