Methods for single exposure—self-aligned double, triple, and quadruple patterning
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United States of America Patent
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Mar 17, 2015
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Dec 15, 2011
filing date -
Dec 15, 2011
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Abstract
A method including forming a pattern on a surface of a substrate, the pattern including one of discrete structures including at least one sidewall defining an oblique angle relative to the surface and discrete structures complemented with a material layer therebetween, the material layer including a volume modified into distinct regions separated by at least one oblique angle relative to the surface; and defining circuit features on the substrate using the pattern, the features having a pitch less than a pitch of the pattern.
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