Apparatus, system, and method for wireless connection in integrated circuit packages

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United States of America Patent

PATENT NO 8981573
APP PUB NO 20140042639A1
SERIAL NO

13970241

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Abstract

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Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sakamoto, Shinichi Tsukuba, JP 153 1747
Tang, Jiamiao Shanghai, CN 13 454
Xu, Henry Shanghai, CN 9 211

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