Integrated circuit packaging system with interconnect and method of manufacture thereof
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United States of America Patent
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Mar 17, 2015
Grant Date -
Sep 29, 2011
app pub date -
Mar 24, 2010
filing date -
Mar 24, 2010
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing an interposer having an interposer first side and an interposer second side opposing the interposer first side; mounting an integrated circuit to the interposer first side, the integrated circuit having a non-active side and an active side with the non-active side facing the interposer; connecting first interconnects between the active side and the interposer first side, the first interconnects having a first density on the interposer first side; mounting the interposer over a package carrier with the interposer first side facing the package carrier; connecting second interconnects between the package carrier and the interposer second side, the second interconnects having a second density on the interposer second side, the second density that is approximately the same as the first density; and forming an encapsulation over the package carrier covering the interposer and the second interconnects.
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