Contact and contactless differential I/O pads for chip-to-chip communication and wireless probing
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United States of America Patent
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Mar 17, 2015
Grant Date -
Oct 18, 2012
app pub date -
May 24, 2012
filing date -
Dec 29, 2010
priority date (Note) -
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Abstract
Contactless differential coupling structures can be used to communicate signals between circuits located on separate chips or from one chip to a probing device. The contactless coupling structures avoid problems (breaks, erosion, corrosion) that can degrade the performance of ohmic-type contact pads. The contactless coupling structures comprise pairs of conductive pads placed in close proximity. Differential signals are applied across a first pair of differential pads, and the signals are coupled wirelessly to a mating pair of conductive pads. Circuitry for generating and receiving differential signals is described.
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