Methods and apparatus for preparing power transmission cables

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United States of America Patent

PATENT NO 8986073
SERIAL NO

13298915

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Abstract

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A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

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Patent Owner(s)

  • TE CONNECTIVITY CORPORATION;TYCO ELECTRONICS RAYCHEM GMBH

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Frye, Terry Edward Cary, US 14 152
Kehl, Ladislaus Dorfen, DE 15 66

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