Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

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United States of America Patent

PATENT NO 8986486
APP PUB NO 20120024469A1
SERIAL NO

13170581

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Abstract

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The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.

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Patent Owner(s)

  • NITTO DENKO CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asai, Fumiteru Osaka, JP 72 417
Shiga, Goji Osaka, JP 50 207
Takamoto, Naohide Osaka, JP 90 411

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