Integrated circuit package system with support carrier and method of manufacture thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8987056
APP PUB NO 20100123242A1
SERIAL NO

12273544

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Abstract

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A method of manufacture of a semiconductor package system includes: attaching an internal stacking module die to a surface of an internal stacking module substrate having an internal stacking module bonding pad along an edge of an opposite surface thereof; and attaching a support carrier to support the internal stacking module substrate by two edges thereof with the internal stacking module bonding pad exposed.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ha, Jong-Woo Seoul, KR 56 1049
Lee, Sung Yoon Inchon-si, KR 8 3
Lim, Taeg Ki Icheon, KR 12 84

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