Method and apparatus for peeling electronic component

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8991464
APP PUB NO 20120312482A1
SERIAL NO

13588506

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Abstract

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A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.

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Patent Owner(s)

Patent OwnerAddress
SOCIONEXT INCKANAGAWA KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Konno, Yoshito Kawasaki, JP 9 78
Yamada, Yutaka Kawasaki, JP 164 2452

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