Bulk fin-field effect transistors with well defined isolation
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United States of America Patent
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Mar 31, 2015
Grant Date -
Feb 13, 2014
app pub date -
Oct 15, 2013
filing date -
Oct 20, 2011
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Abstract
A process fabricates a fin field-effect-transistor by forming a dummy fin structure on a semiconductor substrate. A dielectric layer is formed on the semiconductor substrate. The dielectric layer surrounds the dummy fin structure. The dummy fin structure is removed to form a cavity within the dielectric layer. The cavity exposes a portion of the semiconductor substrate thereby forming an exposed portion of the semiconductor substrate within the cavity. A dopant is implanted into the exposed portion of the semiconductor substrate within the cavity thereby creating a dopant implanted exposed portion of the semiconductor substrate within the cavity. A semiconductor layer is epitaxially grown within the cavity atop the dopant implanted exposed portion of the semiconductor substrate.
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