Sensor matrix with semiconductor components
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United States of America Patent
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Mar 31, 2015
Issued Date -
N/A
app pub date -
Sep 15, 2008
filing date -
Sep 13, 2007
priority date (Note) -
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Abstract
The invention relates to a sensor matrix (1) with semiconductor components and a process for producing such a device, which sensor matrix comprises a laminar carrier layer (3), a first (4) and at least one second (10) electrode arrangement and a component arrangement (6). The first electrode arrangement (4) is disposed on a surface (2) of the carrier layer (3), and the component arrangement (6) is disposed on the first electrode arrangement (4) in the form of a plurality of organic semiconductor components (7). The second electrode arrangement (10) is arranged on a surface (8) of a top layer (9), and the top layer (9) is arranged over the carrier layer (3) so that the first (4) and second (10) electrode arrangements face one another and the second electrode arrangement (10) is in electrically conductive contact, at least in sections, with the component arrangement (6).
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